永乐怎么注销账号

● 集成气动ER弹簧夹头
● 通孔便于产品馈通
● 低惯量轴提供加速度
● 集成旋转接头

● 超低矮外形限度地减少工作高度

高精度 ER 夹头

The collet chuck on the ACS-100LP accepts an ER8 series collet, while the ACS-150LP uses an ER25 collet and the ACS-200LP uses an ER40 collet. These collets are readily available from machine tool component suppliers in sizes that support tube diameters from 0.5 mm to 30 mm. ER collets provide excellent run-out characteristics for applications requiring high-precision gripping of tubular material. The collet is retained with a threaded retaining cap that enables quick changeover, and is configured in a "fail-safe" normally-closed mode where full clamping force is applied when no air pressure is present.

紧凑封装

The design of the ACS LP series direct-drive rotary stage was optimized to minimize stage height. The low profile of the stage reduces the effective working height of the system minimizing “stack-up” related errors.

集成旋转接头

Air is delivered to the collet or gripper assembly through an integral rotary union using a seal-less, frictionless design. This 99% noncontact rotary-union design ensures a lifetime of maintenance-free operation. The combination collet chuck and rotary union assembly also has significantly less friction and inertia than external assemblies created from discrete parts. This reduced inertia improves system performance by allowing higher peak acceleration and reducing position error during laser machining operations.

无刷直驱

The ACS LP series utilizes direct-drive brushless motor technology to maximize positioning performance. Direct-drive technology is optimized for 24/7 production environments because there are no brushes to replace and no gear trains or belts to maintain. Direct drive also provides quicker acceleration and higher top speeds than gear or belt-driven mechanisms, which yields higher total overall throughput.

The low maintenance and high throughput characteristics of the ACS LP, coupled with the integral material handling capability, provide the lowest total cost of ownership when compared to component-level solutions.